Rydev's team of analog engineers have strong experience in analog and mixed signal IC design: from 350 nm and 180 nm HV planar nodes down to 65 nm and SOI technologies. Some of our past designs include: bandgap references, Sigma-Delta modulators, ADCs, LDOs, OpAmps, UVLs, high order continuous filters, HV current sources, etc.
Analog IPs on a 350 nm high-voltage commercial process for a production-ready, high-voltage CMOS low-EMI-signature driver for low-profile center-tapped transformer primary from a 0-15V power supply. Product already in the market (call for more details).
Blocks included:
-Oscillator followed by a gate drive circuit providing complementary output signals to drive ground referenced N
-channel power switches.
-Design of internal logic ensuring non-overlapping (break-before-make) and clock frequency and duty cycle adjustment between the two switches to achieve perfect magnetic balance on the transformer.
Final delivery
-Schematic level design, full corner verification (on agreed specs), final layout, DRC and LVS checks, full chip padframe design and extra circuitry for analog and digital post-fab testing.
-Recommended testing circuits and PCBs for extracting performance metrics. The generation of an initial datasheet for the product and design report with test-results from early samples.
High-voltage isolated analog buffer for an IC to be used in commercial automotive and energy applications. Currently under final testing by the customer (call for details). The design IP included Mixed-Signal blocks on 350 nm high-voltage CMOS commercial process:
-Second-order single-ended SigmaDelta high-swing input switched capacitor modulator
-Single-ended OpAmps and bias circuits, biphasic oscillator and latched comparator for modulator
-Demodulation active RC 2nd order low-pass filter
-Final delivery
-Schematic level design, full corner verification (on agreed specs), final layout, DRC and LVS checks, full chip padframe design and extra circuitry for analog and digital post-fab testing.
-Testing circuits and PCBs for extracting performance metrics. Generation of an initial datasheet for the product and design report with test-results from early samples.
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